silicon pin limiter diodes rev. v20 ma4l & madl series 1 1 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 1 features ? low insertion loss and noise figure ? high peak and average operating power ? various p1db compression powers ? low flat leakage power ? proven reliable, silicon nitride passivation ? rohs compliant description the ma4l and madl series are silicon pin limiter diodes with small and medium i - region lengths which are specifically designed for high signal applications. the devices are designed to provide low insertion loss, at zero bias, as well as low flat leakage power with fast signal response/recovery times. parts are available as discrete die or assembled into a variety of surface mount or ceramic pill packages. see the available case style table for the specific ceramic package styles and their availability for individual part numbers. applications the ma4l and madl series of pin limiter diodes are designed for use in passive limiter control circuits to protect sensitive receiver components such as low noise amplifiers (lna), detectors, and mixers covering the 10 mhz to 18 ghz frequency range. chip outlines 2 2. for the madl - 000301 - 01340w, madl - 000301 - 13880g, ma4l401 - 134 and madl - 000401 - 13880g, b dimension, is 10 1 mils. ods dimension mils mm a (squared) 15 2 0.381 0.51 134, 1421 b 7 1 * 0.178 0.025 1421 c 2.6 x 5.8 0.067 x 0.147 1. package dimensions can be found on the macom website. 31,32 137 1056 1249 30 134 chip 120 186 1088 1387 1388 chip with flying 1421 available packages 1 a b full area cathode c (anode) a ods1421 ods134
silicon pin limiter diodes rev. v20 ma4l & madl series 2 2 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 2 4. high signal performance : measured in a single shunt diode (die) configuration attached directly to the gold plated rf ground of a 50 , sma connectorized, test fixture using 2 mil thick conductive silver epoxy . chip anode contact is thermo - compression wire bonded using a 1 mil. diameter gold wire onto a 7.2 mil thick rogers 5880 duroid microstrip trace. a shunt coil provides the dc return. un - packaged die electrical specifications @ t a = +25c part number minimum v rev 10 a v r maximum v rev 10 a v r minimum c j0v 1 mhz pf maximum c j0v 1 mhz pf maximum r s 10 ma 500 mhz ohms 3 nominal characteristics carrier lifetime i for = +10 ma i rev = - 6 ma ns 3 i - region thickness m contact diameter mils thermal resistance c/w 3 ma4l011 - 134 15 35 0.08 0.18 2.10 10 2 1.2 175 MA4L021 - 134 20 35 0.10 0.20 2.10 10 2 1.2 175 madl - 011021 - 14210g 20 35 0.17 0.24 2.00 10 2 2.6 x 5.8 175 ma4l022 - 134 20 35 0.09 0.19 2.00 10 2 1.2 175 madl - 011009 - 01340w 20 35 0.16 0.23 1.50 10 2 3.0 175 ma4l031 - 134 30 50 0.14 0.21 2.00 20 3 1.4 150 ma4l032 - 134 30 50 0.13 0.20 2.50 15 3 1.5 150 madl - 011010 - 01340w 30 50 0.17 0.24 1.50 15 3 3.0 150 ma4l062 - 134 60 75 0.07 0.15 2.50 10 4 1.5 150 madl - 011011 - 01340w 60 75 0.05 0.17 2.30 10 4 3.0 150 ma4l101 - 134 100 0.15 2.00 90 13 3.5 30 madl - 000301 - 01340w 200 0.20 1.50 200 20 3.0 30 ma4l401 - 134 250 0.30 1.20 800 25 4.5 25 nominal high signal performance 4 @ t a = +25c part number incident peak power for 1 db limiting freq. = 9.4 ghz dbm incident peak power for 10 db limiting freq. = 9.4 ghz dbm incident peak power for 15 db limiting freq. = 9.4 ghz dbm recovery time 3 db peak power = 50 w ns maximum incident peak power watts maximum cw input power watts ma4l011 - 134 7 30 40 10 80 2 MA4L021 - 134 8 31 41 15 90 3 ma4l022 - 134 8 31 41 15 90 3 madl - 011009 - 01340w 8 31 41 10 90 3 madl - 011021 - 14210g 8 31 41 10 90 3 ma4l031 - 134 10 33 43 25 125 4 ma4l032 - 134 11 34 44 25 125 4 madl - 011010 - 01340w 11 34 44 25 125 4 ma4l062 - 134 15 38 50 75 200 5 madl - 011011 - 01340w 15 38 50 75 200 5 ma4l101 - 134 20 45 53 100 250 6 madl - 000301 - 01340w 23 46 59 50 500 7 ma4l401 - 134 30 52 60 250 1000 10 3. test performed with the chip bonded into a ceramic pill package,ods - 30, mounted to an infinite heat - sink. chip only thermal resi stance is approximately 2c/w less.
silicon pin limiter diodes rev. v20 ma4l & madl series 3 3 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 3 typical high signal peak power performance in a single shunt 50 circuit frequency = 9.4 ghz, pulse width = 1 s, duty cycle = 0.001% parameter absolute maximum forward current 100 ma operating temperature - 55c to +125c storage temperature - 55c to +150c junction temperature +175c rf peak & cw incident power per performance table mounting temperature +320c for 10 sec. absolute maximum ratings 5 t a = +25c 5. exceeding any one or combination of these limits may cause permanent damage to this device. 0 db loss line 10 db loss line 20 db loss line 30 db loss line ma4l011 - 134, MA4L021 - 134, ma4l022 - 134, madl - 011009 - 01340w, madl - 011021 - 14210g ma4l031 - 134, ma4l032 - 134, madl - 011010 - 0134w ma4l062 - 134, madl - 011011 - 01340w ma4l101 - 134 ma4l401 - 132 0 5 10 15 20 25 30 35 40 45 0 10 20 30 40 50 output power (dbm) input power (dbm)
silicon pin limiter diodes rev. v20 ma4l & madl series 4 4 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 4 application circuits typical 60 dbm peak power, 1 s p.w., 0.001% duty cycle, 20 dbm flat leakage limiter circuit typical 50 dbm peak power, 1 s p.w., 0.001% duty cycle, 20 dbm flat leakage limiter circuit r f o u t p u t r f i n p u t m a 4 l 1 0 1 - 1 3 4 m a 4 l 0 3 2 - 1 3 4 c o i l : d c r e t u r n t r a n s m i s s i o n l i n e : 9 0 o @ f o t r a n s m i s s i o n l i n e : 9 0 o @ f o m a 4 l 4 0 1 - 1 3 4 r f o u t p u t m a 4 l 0 3 2 - 1 3 4 r f i n p u t m a 4 l 0 2 2 - 1 3 4 c o i l : d c r e t u r n t r a n s m i s s i o n l i n e : 9 0 o @ f o
silicon pin limiter diodes rev. v20 ma4l & madl series 5 5 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 5 notes for specification and nominal high signal performance tables: maximum series resistance : r s , is measured at 500 mhz in the ods - 30 package and is equivalent to the total diode resistance: r s = rj (chip junction resistance) + r o (package ohmic resistance) maximum high signal performance : test freq.= 9.4 ghz, rf pulse width = 1.0 s, duty cycle = 0.001%. measured with a single shunt diode (die) attached directly to the gold plated rf housing ground with 2 mil thick conductive silver epoxy in a 50 , sma, connectorized test fixture. chip anode contact is thermo - compression wire bonded using a 1 mil. diameter gold wire onto a 7.2 mil thick rogers 5880 duroid microstrip trace. a shunt coil provides the dc return. maximum cw incident power : measured in a 50 , sma, connectorized housing @ 4 ghz utilizing a twt amplifier and the same single diode assembly configuration as stated above. die handling and mounting information handling: all semiconductor chips should be handled with care in order to avoid damage or contamination from particulates, salts, and skin oils. for individual die, the use of plastic tipped tweezers or vacuum pick up tools is strongly recommended. bulk handling should ensure that abrasion and mechanical shock are minimized. die attach: the die have ti - pt - au back and anode metal, with a final gold thickness of 1.0 m. die can be mounted with a gold - tin, eutectic solder perform or conductive silver epoxy. the metal rf and d.c. ground plane mounting surface must be free of contamination and should have a surface flatness or < 2 mils. ? eutectic die attachment using hot gas die bonder: an 80/20, gold / tin eutectic solder perform is recommended with a work surface temperature of 255c and a tool tip temperature of 220c. when the hot gas is applied, the temperature at the tool tip should be approximately 290c. the chip should not be exposed to a temperatures in excess of 320c for more than 10 seconds. ? eutectic die attachment using reflow oven: refer to application note m538 surface mounting instructions. ? epoxy die attachment: a thin, controlled amount of electrically conductive silver epoxy should be applied, approximately 1 - 2 mils thick to minimize ohmic and thermal resistances. a small epoxy fillet should be visible around the outer perimeter of the chip after placement to ensure full area coverage. cure the conductive silver epoxy per the manufacturers schedule, typically 150?c for 1 hour. wire bonding: the chips top contact (anode) metallization layer is comprised of ti/pt/au with a final gold thickness of 1.0 m. thermo - compression wedge bonding using a 0.7 or 1.0 mil diameter gold wire is recommended. the heat stage temperature should be set to approximately 200c with a tool tip temperature of 125?c and a force of 18 to 40 grams. use of ultrasonic energy is not advised but if necessary should be adjusted to the minimum setting required to achieve a good bond. excessive energy or force applied to the top contact will cause the metallization to dislodge and lift off. automatic ball bonding may also be used. see application note m541 bonding and handling procedures for chip diode devices for more detailed handling and assembly information.
silicon pin limiter diodes rev. v20 ma4l & madl series 6 6 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 6 part numbering and ordering information when ordering : use the base part number followed by a dash plus the desired package style suffix or base part only as defined in table i available case styles below. for example: the ma4l011 in the 186 style package becomes ma4l011 - 186 or for just the chip ma4l011 - 134. base part available package styles ma4l011 30, 31, 32, 54, 134 (chip), 137,186, 1056, 1088 madl - 000011 - 13880g base part (ma4l011 - 134 chip with flying leads) MA4L021 31, 120, 134 (chip), 1056 madl - 011021 - 14210g base part (MA4L021 - 134 chip with rectangular contact) ma4l022 30, 32, 120, 134 (chip), 137, 186, 1056 madl - 011009 - 01340w base part (134 chip) ma4l031 31, 36, 134 (chip), 186, 1056 madl - 000031 - 13880g base part (ma4l031 - 134 chip with flying leads) ma4l032 31, 32, 134 (chip), 186, 1056 madl - 000032 - 00300 base part (ma4l032 chip in 30 package) madl - 011010 - 01340w base part (134 chip) ma4l062 - 134 base part (134 chip) madl - 000062 - 105600 base part ( ma4l062 chip in 1056 package) madl - 000062 - 13880g base part (ma4l062 - 134 chip with flying leads) madl - 011011 - 01340w base part (134 chip) ma4l101 30, 134 (chip), 186 madl - 000101 - 13880g base part (ma4l101 - 134 chip with flying leads) ma4l301 31,1056 madl - 000301 - 01340w base part ( ma4l301 chip) madl - 000301 - 13870g base part (ma4l301 - 134 chip with flying leads) ma4l401 30, 31, 120,134 (chip), 1056 madl - 000401 - 13870g base part (ma4l401 - 134 chip with flying leads) table i available case styles 6 6. see table i associated package parasitics.
silicon pin limiter diodes rev. v20 ma4l & madl series 7 7 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 7 package style package description nominal c pkg pf l s nh 30 ceramic pill 0.18 0.60 31 ceramic pill 0.18 0.60 32 ceramic pill 0.30 0.40 120 ceramic pill 0.13 0.40 134 chip 137 epoxy encapsulated ceramic surface mount with leads 0.14 0.70 186 ceramic surface mount with leads 0.15 0.70 1056 ceramic surface mount with wrap around contacts 0.20 0.70 1088 epoxy encapsulated ceramic surface mount with leads 0.12 0.70 1387 chip with flying leads 1388 chip with flying leads 1421 chip with rectangular contact table i associated package parasitics 7 31,32 137 1056 1249 30 134 chip 120 186 1088 1387 1388 chip with flying 1421
silicon pin limiter diodes rev. v20 ma4l & madl series 8 8 m/a - com technology solutions inc. (macom) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. visit www.macom.com for additional data sheets and product information. for further information and support please visit: https://www.macom.com/support 8 m/a - com technology solutions inc. all rights reserved. information in this document is provided in connection with m/a - com technology solutions inc ("macom") products. these materials are provided by macom as a service to its customers and may be used for informational purposes only. except as provided in macom's terms and conditions of sale for such products or in any separate agreement related to this document, macom assumes no liability whatsoever. macom assumes no responsibility for errors or omissions in these materials. macom may make changes to specifications and product descriptions at any time, without notice. macom makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions. no license, express or implied, by estoppels or otherwise, to any intellectual property rights is granted by this document. these materials are provided "as is" without warranty of any kind, either express or implied, relating to sale and/or use of macom products including liability or warranties relating to fitness for a particular purpose, consequential or incidental damages, merchantability, or infringement of any patent, copyright or other intellectual property right. macom further does not warrant the accuracy or completeness of the information, text, graphics or other items contained within these materials. macom shall not be liable for any special, indirect, incidental, or consequential damages, including without limitation, lost revenues or lost profits, which may result from the use of these materials. macom products are not intended for use in medical, lifesaving or life sustaining applications. macom customers using or selling macom products for use in such applications do so at their own risk and agree to fully indemnify macom for any damages resulting from such improper use or sale.
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